Mirka® Polishing Foam Pad Ø 150 mm Black M Waffle

This Black waffled foam pad is especially well suited for polishing darker colours in combination with Polarshine® 12 Black polishing compound. The reticulated foam has an excellent balance in elasticity and softness. The waffle shape is an optimized pattern for long-lasting and an improved cutting performance, and it reduces the surface temperature during polishing. Thickness 25 mm.

Technical details