Mirka® Polishing Foam Pad Ø 85 mm Black Waffle

A reticulated waffle shape structured foam pad for hologram removal gives an excellent finishing on both fresh and fully cured paint works. The good balance between elasticity and density in the foam contributes to the final result. The pad is designed to be used in combination with Polarshine® 5 polishing compound and Polarshine® 3 Antistatic wax. Thickness 25 mm.

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