Mirka® Polishing Foam Pad Ø 85 mm Black M Waffle

This Black waffled foam pad is especially well suited for polishing darker
colours in combination with Polarshine® 12 Black polishing compound. The
reticulated foam has an excellent balance in elasticity and softness. The waffle
shape is an optimized pattern for long-lasting and an improved cutting
performance, and it reduces the surface temperature during polishing. Thickness
25 mm.